New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Wed Jun 26 08:53:32 EDT 2002 | davef
We have not done a DOE on board warping. Consider: * How close the board gets to its Tg during the reflow cycle * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * Time at temperature
Electronics Forum | Wed Dec 27 21:12:30 EST 2000 | Dave F
From a process perspective, I don�t know if you should be concerned ... You've told us nothing about your process. THE BOOK JEDEC MO-51 allows 6 thou warp in smaller [1mm pitch] BGA and 8 thou in larger [ 1.27mm and 1.5mm pitch] BGA. The increase
Industry News | 2016-10-26 14:55:50.0
Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
